Advance Binary Mask
Manufacturing steps
-Exposure by e-beam or laser beam
-Post Exposure Bake
-Development
-CrOx/Cr Etching by dry/wet Etching Process
-Photoresist Stripping
Phase Shifting Mask
Phase-shift masks are photomask that take advantage of the interference generated by Phase differences to improve image resolution in photolithography. There exist alternating and attenuated phase shift masks
Manufacturing Steps
-Exposure by e-beam or laser beam
-Post Exposure Bake
-Development
-CrOx/Cr Etching by dry/wet Etching Process
-Photoresist Stripping
-PSM Layer Etching
-Second PR Coating/Patterning
-Removal of Cr & Pr Film
Optical Proximity Correction (OPC)
(OPC) is a photolithography enhancement technique commonly used to compensate for image errors due to diffraction or process effects and employ to improve the quality of high-performance integrated circuit designs.
At Remarkable we are proud to provide OPC on photomask as per semiconductor manufacturers request.